Method of fabricating a saw device

Details Method of fabricating a saw device Method of fabricating a saw device

1993-06-02

1994-07-05

Hall, Carl E.

Metal working

Piezoelectric device making

310313B, 333195, H01L 4122

Patent

active

053255739

ABSTRACT:
A surface-acoustic-wave device comprises a substrate of a piezoelectric material for providing a passage of surface acoustic waves at an upper major surface of the substrate, a plurality of interdigital electrodes provided on the piezoelectric substrate in a row in correspondence to the passage of surface acoustic waves such that the electrodes are aligned in the propagating direction of the surface acoustic waves, each of the plurality of interdigital electrodes having a first part connected to a bonding pad on the substrate for external electric connection and having a plurality of finger electrodes extending parallel with each other in a direction crossing the propagating surface acoustic waves, and a second part separated from the first part and having a plurality of finger electrodes extending parallel with each other in a direction opposite to the direction of the finger electrodes of the first part. An interconnection pattern is provided on the surface of the substrate in correspondence to a region offset from the passage of the surface acoustic waves for connecting the second parts of adjacent interdigital electrodes with each other.

REFERENCES:
patent: 4203082 (1980-05-01), Tsukamoto et al.
patent: 4223284 (1980-09-01), Inoue et al.
patent: 4247836 (1981-01-01), Redwood et al.
patent: 4492940 (1985-01-01), Hikita
patent: 4649357 (1987-03-01), Nagai et al.
patent: 5115160 (1992-05-01), Knoll et al.
Patent Abstracts of Japan, vol. 7, No. 111 (E-175) May 14, 1983 & JP-A-58 031608 (Tokyo Shibaura Denki) Feb. 24, 1983.
Patent Abstracts of Japan, vol. 8, No. 88 (E-240) Apr. 21, 1984 & JP-A-59 008420 (Citizen) Jan. 17, 1984.

Affiliated with

Also associated with

Rating

Method of fabricating a saw device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of fabricating a saw device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of fabricating a saw device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-788592