Sawcut method of forming alignment marks on two faces of a subst

Details Sawcut method of forming alignment marks on two faces of a subst Sawcut method of forming alignment marks on two faces of a subst

1993-07-28

1996-12-03

Rada, Rinaldi I.

Fishing, trapping, and vermin destroying

83 33, 83 36, 83 39, 83862, 83875, 148DIG28, H01L 2102

Patent

active

055808310

ABSTRACT:
The present invention is a method for producing alignment marks on opposite faces of a generally flat substrate such as a semiconductor wafer. First, reference cuts are produced at the edges of the substrate at four points around the wafer. Next, the center line is determined on the first face of the substrate between two oppositely disposed reference cuts. First and second grooves are then cut in the first face of the substrate a first predetermined distance from the first center line. Third and fourth grooves are cut in the first face perpendicular to and through the first and second grooves at the first predetermined distance from the second reference cut forming crosshair alignment patterns. Next, the center line is determined on the second face of the substrate between the third and fourth reference cuts, and fifth and sixth grooves are cut in the second face of the substrate a second predetermined distance from the second center line. Finally, seventh and eighth grooves are cut in the second face of the substrate perpendicular to and through the fifth and sixth grooves at the second predetermined distance from the second reference cut. Thus, pairs of crosshairs are located on opposite faces of the substrate based upon reference cuts easily locatable from either side. In a preferred embodiment, the first and second predetermined distances are different from one another, to allow the cuts on opposite faces to be offset to prevent mechanical failure.

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