Method for minimizing unwanted metallization in periphery die on

Details Method for minimizing unwanted metallization in periphery die on Method for minimizing unwanted metallization in periphery die on

1994-09-30

1996-12-03

Thomas, Tom

Fishing, trapping, and vermin destroying

437228, 437924, 430 5, 148DIG102, H01L 21301, H01L 21027

Patent

active

055808298

ABSTRACT:
A method and apparatus for providing a mask (200) on a multi-site wafer (100) is accomplished by first creating a first mask key (204) which contains information, such as alignment cues and test structures. A copy of the first mask key is modified to produce a second mask key (201). When the two mask keys are transferred to adjacent sites on the wafer, they physically overlap, preventing double-exposure of the information in the first mask key.

REFERENCES:
patent: 3863331 (1975-02-01), Schade
patent: 4753901 (1988-06-01), Ellsworth et al.
patent: 4849313 (1989-07-01), Chapman et al.
patent: 5003374 (1991-03-01), Vokoun
patent: 5250983 (1993-10-01), Yamamura
patent: 5407763 (1995-04-01), Pai
S. Wolf & R. N. Tauber, "Silicon Processing for the VLSI Era" vol. I, 1986 p. 472-483.

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