Composite enclosure for electronic hardware

Details Composite enclosure for electronic hardware Composite enclosure for electronic hardware

1994-06-16

1996-05-28

Ryan, Patrick J.

Stock material or miscellaneous articles

Hollow or container type article

Polymer or resin containing

428225, 428167, 174 35MS, 264105, 336 84C, 361816, 361831, 439485, B32B 900

Patent

active

055209769

ABSTRACT:
The present invention contemplates a significant departure from known shielded enclosure designs by providing an enclosure for electronic modules, comprising walls made of composite material including conductive fibers for shielding the enclosure interior from electromagnetic radiation, and means for securely mounting at least one module inside the enclosure with a fastener means, the mounting means comprising composite material. The present invention further contemplates methods for making shielded enclosures and card guides for such enclosures that represent a significant improvement over known enclosure designs. This invention contemplates composite cold walls and composite fins. These composite fins and cold walls may be used alone or together in structures and enclosures which are useful in conducting heat.

REFERENCES:
patent: H526 (1988-09-01), Miller
patent: 3219747 (1965-11-01), McAdams
patent: 3992653 (1976-11-01), Richardson et al.
patent: 4004194 (1977-01-01), Doerflinger et al.
patent: 4227037 (1980-10-01), Layton
patent: 4530949 (1985-07-01), Atkinson et al.
patent: 4608453 (1986-08-01), Freeman
patent: 4731698 (1988-03-01), Millot et al.
patent: 4775260 (1988-10-01), Keemer
patent: 4785136 (1988-11-01), Mollet et al.
patent: 4791236 (1988-12-01), Klein et al.
patent: 5016141 (1991-05-01), Lorig et al.
patent: 5035942 (1991-07-01), Nagata et al.
patent: 5115104 (1992-05-01), Bunyan
patent: 5136119 (1992-08-01), Leyland
patent: 5217770 (1993-06-01), Morris, Jr. et al.
Donegan, Thermal Connection For Circuit Package, IBM Technical Disclosure Bulletin, vol. 13, No. 7, Dec. 1970.
JP 61-029161, Patent Abstract of Japan, "Thermal conductive Cooling Module Device", Feb. 1986.
JP 62-029151, Patent Abstract of Japan, "Cooling Module For Semiconductor Device", Feb., 1987.
European Search Report for EP 94 30 4799 mailed May 29, 1995.
Camloc Products Division, P.C. Board Fasteners, Selector Guide. Camloc fastener technology sets new standards for P.C. board access, pp. E-1 --E-3.
Glatz et al, Application of Advanced Composites in Sem-E heatsinks for the Thermal Management of Avionics, 5th International SAMPE Electronics Conference, Jun. 18-20, 1991, pp. 451-467.
Runnacles et al, Heat Treatment of Mesophase Pitch Based Low/Intermediate Modulus Fibers for C-C Applications, pp. 33-53 (1992).
Morgan, Applications of Composite Material Systems to Avionic Systems Packaging, (1991).
Riley, Composite Heat Transfer Materials for Electronic Packaging in Future Dod Systems, pp. 2-M-1 --2-M-14, (1991).
Riley/Kesapradist, Advanced Composites Tailored For Use In Electronic Packaging, Conference date Feb. 3, 1992, (1992).
Glatz et al, Application of Resin and Metal Matrix Composites to Advanced Avionics Enclosure, 5th International SAMPE Electronics Conference, Jun. 18-20, 1991, pp. 434-450.

Affiliated with

Also associated with

Rating

Composite enclosure for electronic hardware does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composite enclosure for electronic hardware, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composite enclosure for electronic hardware will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-785276