Package for a light-responsive semiconductor chip

Details Package for a light-responsive semiconductor chip Package for a light-responsive semiconductor chip

1990-08-02

1992-02-11

Hille, Rolf

357 72, 357 73, H01L 2302

Patent

active

050879642

ABSTRACT:
A semiconductor device having a semiconductor chip packaged in a semiconductor container, which operates in receiving visible light, near infrared light and ultraviolet light, the semiconductor device includes a lower plate formed of a material which hardly transmits light with high insulation resistance and high mechanical intensity and has coefficient of linear expansion almost the same as that of the semiconductor chip, the semiconductor chip mounted on the lower plate, a middle plate comprising a single-layer or a multiple-layer wiring board, and an upper plate formed of a material which hardly transmits light with high insulation resistance and high mechanical intensity and has coefficient of linear expansion almost the same as that of the lower plate and having a window for incident light at one part thereof, in which the lower plate and the upper plate are bonded with putting the middle plate therebetween and an upper part of the upper plate is sealed by a lid formed of glass or a synthetic resin.

REFERENCES:
patent: 4760440 (1988-07-01), Bigler et al.
patent: 4873566 (1989-10-01), Hokanson et al.
patent: 4879588 (1989-11-01), Ohtsuka et al.
patent: 4891686 (1990-01-01), Krausse, III
patent: 4953001 (1990-08-01), Kaiser, Jr. et al.
patent: 4985753 (1991-01-01), Fujioka et al.
patent: 4990719 (1991-02-01), Wright
IBM Technical Disclosure Bulletin, vol. 27, No. 3, Aug. 1984, "Hermetic Seal for Semiconductor Package" by Olah et al., p. 1701.

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