Semiconductor memory device

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357 42, 357 51, 357 59, H01L 2702

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050879561

ABSTRACT:
An SRAM including a memory cell having a high-resistance load element. The load element is formed from a polysilicon film, and an impurity is introduced into at least a part of the polysilicon film for the purpose of increasing the threshold voltage of a parasitic MISFET formed using the load element as its channel region. Alternatively, the deposition of the polysilicon film is carried out at a relatively high temperature, thereby preventing any increase in the current flowing through the load element, and thus reducing the power dissipation in the SRAM.

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Semiconductor Devices Physics And Technology, S. M. Sze.

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