Shock wave particle removal method and apparatus

Electric heating – Metal heating – By arc

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Details

21912168, 21912169, B23K 2600

Patent

active

050234242

ABSTRACT:
An apparatus and method using laser induced shock waves to dislodge particles from a wafer surface. The apparatus includes a wafer support, a particle detector and computer for locating and storing the locations of particles on the wafer, a laser, and focusing optics. Laser beam pulses are directed toward the wafer surface at a shallow angle or with a large beam convergence angle to avoid damage to the wafer.

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