Conductive circuit board and method for making

Details Conductive circuit board and method for making Conductive circuit board and method for making

1997-11-19

1999-09-21

Speer, Timothy

Stock material or miscellaneous articles

Web or sheet containing structurally defined element or...

Adhesive outermost layer

428344, 428335, 174258, 174259, 1563071, 1563077, 430 83, H01L 27108, H01L 21312, H01L 213205

Patent

active

059551925

ABSTRACT:
A conductive circuit board is prepared by forming a film of organopolysilane having a H-Si bond on a substrate, selectively exposing the organopolysilane film to light to form a photo-crosslinked layer in exposed areas, dissolving away unexposed areas, and contacting a silver salt with the photo-crosslinked layer and reducing the silver salt to form a silver conductive layer thereon. A conductive circuit board comprising a circuit-patterned film of photo-crosslinked polymer on a substrate and a silver conductive layer on the film has high and stable electric property.

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English Abstract of JP 5-72694.
English Abstract of JP 6-291273.
English Abstract of JP 7-114188.
English Abstract of JP 57-11339.

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