Structure and manufacturing method for thin-film semiconductor d

Details Structure and manufacturing method for thin-film semiconductor d Structure and manufacturing method for thin-film semiconductor d

1991-01-28

1992-08-04

James, Andrew J.

357 59, 357 76, H01L 2906, H01L 2904, H01L 2332

Patent

active

051363488

ABSTRACT:
A structure and manufacturing method for a thin film semiconductor device consisting of a single diode or a plurality of diodes connected in series, the device being formed of at least one pair of mutually adjacent P-type (23a) and N-type (23b) regions formed in a layer of polycrystalline silicon (23) deposited on an insulating film (22) upon a substrate (21), to thereby define at least one PN junction. Each of the p-type regions and N-type regions is shaped as a rectangle, with opposite ends of each PN junction formed between these regions being respectively defined by two opposing sides of the polycrystalline silicon layer. Since each of the PN junctions is substantially rectilinear, an even distribution of current flow through each PN junction is attained, whereby a high resistance to destruction and an extremely stable value of reverse bias breakdown voltage are achieved.

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"I-V Characteristics of Polycrystalline Silicon with n+pn+ Structure", J. Appl. Phys 57(4) Feb. 15, 1985, pp. 1190-1193, Y. Saito et al.

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