Aperture plate and a method of manufacturing the same

Details Aperture plate and a method of manufacturing the same Aperture plate and a method of manufacturing the same

1994-06-14

1996-05-28

Powell, William

Etching a substrate: processes

Forming or treating mask used for its nonetching function

1566301, 1566441, 216 2, 216 56, 428131, 430 5, 437225, B44C 122, C25F 300

Patent

active

055202977

ABSTRACT:
A semiconductor substrate has a plurality of chip portions and chip separating portions for partitioning the plurality of chip portions into each other. The plurality of chip portions and the separating portions are etched on one side of the semiconductor substrate so that each of the plurality of chip portions is provided with stencil patterns. Furthermore, the plurality of chip portions and chip separating portions are etched on the other side of the semiconductor substrate so that the stencil patterns are exposed and the plurality of chip portions are capable of being substantially separated from each other.

REFERENCES:
patent: 4021276 (1977-05-01), Cho et al.
patent: 4417946 (1983-11-01), Bohlen et al.
patent: 4589952 (1986-05-01), Behringer et al.

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