Semiconductor chip module

Details Semiconductor chip module Semiconductor chip module

1989-04-12

1990-11-13

Hille, Rolf

357 80, 357 75, H01L 2312, H01L 2304

Patent

active

049705776

ABSTRACT:
A semiconductor chip module includes semiconductor chips each of which has contacts on its entire front face. A multi-layered organic circuit board having a small dielectric constant is provided for mounting the semiconductor chips. Intermediate ceramic substrates having the same thermal expansion coefficient as that of the semiconductor chip, are also provided. Each such intermediate ceramic substrate has contacts on its front and back faces corresponding to those of the semiconductor chip. These contacts are electrically connected directly in a one-to-one relationship. The contacts on the semiconductor chip and the corresponding ones on the front face of the intermediate ceramic substrates are connected by solder. The contacts on the back face of the intermediate ceramic substrate and the corresponding contacts on the front face of the multi-layered ceramic circuit board are connected by respective conductive pins having a predetermined flexibility and rigidity through a predetermined gap therebetween. With this arrangement, the relative displacement due to a thermal expansion difference between the intermediate ceramic substrate and the multi-layered organic circuit board is permitted without causing substantial stress thereon.

REFERENCES:
patent: 4231154 (1980-11-01), Gazdik et al.
patent: 4654694 (1987-03-01), Val
patent: 4663649 (1987-05-01), Suzuki et al.
patent: 4724472 (1988-02-01), Sugimoto et al.
patent: 4783722 (1988-11-01), Osaki et al.

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