Method and apparatus for bonding components leads to pads locate

Details Method and apparatus for bonding components leads to pads locate Method and apparatus for bonding components leads to pads locate

1990-03-02

1990-11-13

Albritton, C. L.

Electric heating

Metal heating

By arc

21912164, B23K 2600

Patent

active

049703650

ABSTRACT:
Component leads are bonded to pads disposed on a non-rigid substrate by the application of a combination of laser energy and ultrasonic energy. The pads preferably are bare copper pads, without a noble metal coating or a chemical pretreatment, and the non-rigid substrate is preferably an epoxy printed circuit board.

REFERENCES:
patent: 3304403 (1967-02-01), Harper
patent: 4330699 (1982-05-01), Farrow
patent: 4534811 (1985-08-01), Ainslie et al.
patent: 4700044 (1987-10-01), Hokanson et al.
P. Chalco et al., "Discrete Wire Bonding Using Laser Energy", Semiconductor International, May, 1988.
IBM Technical Disclosure Bulletin, "Intrinsic-Thermocouple Process Monitor", vol. 29, No. 11, Apr., 1987, p. 4870.
Research Disclosure, "Diffusion Bonding", Jan., 1987, No. 273.

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