Method for forming a shielding structure for decoupling signal t

Details Method for forming a shielding structure for decoupling signal t Method for forming a shielding structure for decoupling signal t

1991-12-09

1992-08-04

Quach, T. N.

Fishing, trapping, and vermin destroying

437 50, 437 60, H01L 21283

Patent

active

051358891

ABSTRACT:
A method for forming a semiconductor structure including parallel spaced conducting traces each physically separated by a grounding trace. The grounding traces are located in between the conducting traces to provide a shielding structure to diminish capacitive coupling between the conducting traces. At the same time, each conducting traces is capacitively coupled to each adjacent pair of grounding traces and the grounding traces are connected to a ground such as a grounded substrate. The grounding traces are formed on a different layer of the semiconductor structure from the conducting traces such that a layout area of the conducting traces is not affected.

REFERENCES:
patent: 4177488 (1979-12-01), Sakai
patent: 4714981 (1987-12-01), Gordon
patent: 4716549 (1987-12-01), Nakano et al.
patent: 4879631 (1989-11-01), Johnson et al.
patent: 4962476 (1990-10-01), Kawada
patent: 4994688 (1991-02-01), Horiguchi

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