Method of producing isoplanar isolated active regions

Fishing – trapping – and vermin destroying

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437 89, 437 90, 437228, H01L 21265

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active

051358840

ABSTRACT:
A method is provided for forming isoplanar isolated regions in an integrated circuit, and an integrated circuit formed according to the same. According to a first disclosed embodiment, a first epitaxial layer is formed over a substrate, the substrate having a (100) crystal orientation. A first masking layer is formed over the first epitaxial layer. The first masking layer is patterned and the first epitaxial layer is etched to form openings. The sidewalls of these openings have a (111) crystal orientation. The first masking layer is then removed and a second masking layer is formed in the openings. The first epitaxial layer is anodized and oxidized. The second masking layer is removed and a second epitaxial layer is formed in the openings. According to an alternate embodiment, after the first epitaxial layer is anodized, the second epitaxial layer is formed in the openings and the first epitaxial layer is then oxidized. According to a further alternate embodiment, the first epitaxial layer is anodized and oxidized after the second epitaxial layer is formed in the openings.

REFERENCES:
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Ghandhi, S., "VLSI Fabrication Principles . . . ", pp. 401-407, 1983.
IEDM, 1983, titled "Device Isolation Technology by Selective Low-Pressure Silicon Epitaxy," pp. 35-38, by H. J. Voss et al.
IEDM, 1983, titled "CMOS Technology Using SEG Isolation Technique," pp. 31-34, by N. Endo et al.
IEDM, 1984, titled "Application of Selective Silicon Epitaxial Growth for CMOS Technology," pp. 593-596, by S. Nagao, et al.
Proceedings of IEEE, vol. 70, No. 5, May 1982, pp. 420-426, titled "Silicon as a Mechanical Material" by Kurt E. Peterson.
S. M. Sze's Textbook, "Physics of Semiconductor Devices," pp. 7-13, 2nd ed. 1981, by John Wiley & Sons, Inc.
IEDM, 1982, titled "Novel Device Isolation Technology with Selective Epitaxial Growth," pp. 241-244, by Endo et al.

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