Method of using copolyether ester amides as thermoplastic adhesi

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

156291, 1563309, 1563318, 428198, 428200, 428201, 428206, 428246, 428261, 428287, B32B 3112, B32B 714

Patent

active

043680909

ABSTRACT:
Copolyether ester amides having a melting point between about 85.degree. and 140.degree. C. are produced from:

REFERENCES:
patent: Re27939 (1974-03-01), Raabe
patent: 2252555 (1941-08-01), Carothers
patent: 3515702 (1970-06-01), Raabe
patent: 3667422 (1972-06-01), Saladin
patent: 3799899 (1974-03-01), Feinauer et al.
patent: 3839121 (1974-10-01), Schmitt et al.
patent: 3883485 (1975-05-01), Raabe et al.
patent: 3883487 (1975-05-01), Raabe et al.
patent: 3948844 (1976-04-01), Raabe et al.
patent: 3950297 (1976-04-01), Raabe et al.
patent: 4035436 (1977-07-01), Matsubara et al.
patent: 4046747 (1977-09-01), Capelle et al.
patent: 4076881 (1978-02-01), Sato
patent: 4101534 (1978-07-01), Ueno et al.
patent: 4130603 (1978-12-01), Tanaka et al.
patent: 4139613 (1979-02-01), Hefele
patent: 4183978 (1980-01-01), Hefele
patent: 4217435 (1980-08-01), McConnell et al.
patent: 4237040 (1980-12-01), Capelle et al.
Scholten, "From Basting to Bonding of Interlinings", Lichtbogen, 1972, No. 167, (5/XXI), pp. 17-19.

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Method of using copolyether ester amides as thermoplastic adhesi does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Method of using copolyether ester amides as thermoplastic adhesi, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Method of using copolyether ester amides as thermoplastic adhesi will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-777530

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.