Thin film multilayer laminate interconnection board

Details Thin film multilayer laminate interconnection board Thin film multilayer laminate interconnection board

1990-03-28

1990-11-13

Powell, William A.

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

156634, 156656, 156902, 428901, B44C 122, C23F 102, B32B 300, B32B 700

Patent

active

049701061

ABSTRACT:
A method of assembling a multilayer laminate interconnection board, particularly boards in which each layer preferably includes copper conductors on polyimide film layers, involves adhesively joining individual layers of wired film initially onto an auxiliary pin carrier substrate and then onto a previously laminated layer. After each layer is aligned and adhesively joined to the immediately preceeding layer, holes are formed through the layer. Metal is deposited into the holes for electrically connecting conductors on the top surface of the last layer to a via located on the immediately preceeding layer. The process is repeated for each layer of the multilayer laminate interconnection board until the entire board is completely assembled. Alternatively, layers containing preformed and metalized holes at the location of a respective via in a particular layer are aligned and adhesively laminated.

REFERENCES:
patent: 4622058 (1986-11-01), Leary-Renick et al.

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