Method for filling gaps between substrates using a low temperatu

Details Method for filling gaps between substrates using a low temperatu Method for filling gaps between substrates using a low temperatu

1991-02-11

1992-08-04

Gallagher, John J.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 79, 15624422, 156305, 156334, 264 465, 521 89, 521139, B32B 3102

Patent

active

051355949

ABSTRACT:
The present invention discloses a hot melt sealant comprising a thermosetting styrene butadiene diblock copolymer and a styrene butadiene terpolymer. The composition is capable of flowing, expanding and curing at temperatures below 300.degree. F. Also disclosed is a method of making the sealant and a method of using the sealant.

REFERENCES:
patent: 4320076 (1982-03-01), Greenwood
patent: 4555284 (1985-11-01), Quell et al.
patent: 4693772 (1987-09-01), Douglas

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