Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1992-09-02
1994-11-29
Thompson, Gregory D.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
257713, 257721, 257796, 361707, 361728, 361813, H05K 720
Patent
active
053695500
ABSTRACT:
Method and apparatus for improving the cooling of a molded package assembly for one or more integrated-circuit dies, each of which is attached to a die-attach paddle portion of a lead frame. The improved package includes a molded-plastic package body which is formed around the lead frame and the attached integrated-circuit die. The package body has one or more through-holes formed through it for passage of air, where the air currents are drawn by convection or forced through the through-hole for cooling the integrated-circuit die attached the die-attach paddle. The die-attach paddle has a corresponding hole formed in it and the through-hole formed in the package body is located adjacent to the hole in the die-attach paddle to form a through-channel through the lead frame and the molded plastic body for convection cooling. The die-attach paddle is covered with molded plastic material so that the die-attach paddle is not exposed in the through-channel. The through-hole formed in the molded-plastic body has inwardly projecting portions which form cooling fins. The lower surface of the package body is spaced apart from the ends of the external leads to provide a standoff space from which cooling air is drawn.
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Gupta et al, "Protection Device for Fluid-Cooled Electrical Apparatus", IBM Tech. Bulletin, vol. 26, No. 2, Jul. 1991, pp. 955-956.
King Patrick T.
Thompson Gregory D.
VLSI Technology Inc.
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