Cutting – Processes
Patent
1997-02-04
1998-09-15
Rachuba, Maurina T.
Cutting
Processes
83 15, B26D 100
Patent
active
058063889
ABSTRACT:
A process for manufacturing an optical recording medium having in order, a substrate, a recording film and a protective substrate and having a predetermined size, in which the protective substrate is stacked on the substrate using an adhesive layer at least outside a recording area of the recording film. The process comprises a step for cutting out an optical recording medium of a predetermined size, by using a cutting edge, from the optical recording medium of a work size, which is larger than the predetermined size. The work-sized optical recording medium comprises a substrate having the recording film on its surface, a work-sized protective substrate provided on the work-sized substrate using an adhesive layer at least in an area outside of a recording area, including an outside area of the predetermined size. The cutting step is performed in such a way that the adhesive layer, positioned at least inside a position where a cutting edge is made to enter the work-sized optical recording medium, is substantially not deformed. Thus, it is possible to provide a process of manufacturing a high-quality optical recording medium at a low cost.
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Canon Kabushiki Kaisha
Rachuba Maurina T.
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