Electronic circuit substrate

Electricity: electrical systems and devices – Miscellaneous

Patent

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Details

361414, 174258, 174260, 29851, 427 96, H05K 103, H05K 332

Patent

active

051445360

ABSTRACT:
An electronic circuit substrate excellent in reliability, which comprises a porous ceramic sintered body with film devices such as a conductive circuit, a resistor and a capacitor directly formed on a surface thereof. A resin is filled in the pores of the porous ceramic sintered body, and the bottom surface of the film devices are fit into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedged state. A method of producing the aforesaid electronic circuit substrate comprises the steps of forming film devices directly on a surface of a porous ceramic sintered body. Then, filling the pores of the porous ceramic sintered body with a resin so as to fit the under surface of the film devices into the pores and recesses on the surface of the porous ceramic sintered body in close contact therewith in a wedge state.

REFERENCES:
patent: 3652332 (1972-03-01), Brand et al.
patent: 4412377 (1983-11-01), Nagashima et al.
patent: 4614837 (1986-09-01), Kane et al.
patent: 4721831 (1988-01-01), Vora
patent: 4799983 (1989-01-01), Desai
patent: 4882455 (1989-11-01), Sato et al.
patent: 4940623 (1990-07-01), Bosna et al.
IBM Technical Disclosure Bulletin, vol. 27, No. 7A, Dec. 1984; "Protective Film Ceramic Substrates", by A. J. Lavin.

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