Patent
1990-07-31
1992-09-01
James, Andrew J.
357 52, 357 71, 357 72, H01L 2934
Patent
active
051444070
ABSTRACT:
Semiconductor chips are protected from handling damage by formation of a polymer dielectric layer at least 2 microns thick on the chip surface before dicing or shortly after dicing. The polymer dielectric layer may be a thermoplastic material or a thermoset material.
REFERENCES:
patent: 3615913 (1971-10-01), Shaw
patent: 3930919 (1976-01-01), Chant et al.
patent: 4327369 (1982-04-01), Kaplan
patent: 4331970 (1982-05-01), Yerman
patent: 4388128 (1983-06-01), Ogawa et al.
patent: 4388132 (1983-06-01), Hoge et al.
patent: 4499149 (1985-02-01), Berger
patent: 4571322 (1986-02-01), Eichelberger et al.
patent: 4632798 (1986-12-01), Eickman et al.
patent: 4652598 (1987-03-01), Edelman
patent: 4701999 (1987-10-01), Palmer
patent: 4714516 (1987-12-01), Eichelberger et al.
patent: 4758875 (1988-07-01), Fujisaki et al.
patent: 4783695 (1988-11-01), Eichelberger
patent: 4823234 (1989-04-01), Konishi et al.
patent: 4933042 (1990-06-01), Eichelberger et al.
patent: 4990993 (1991-02-01), Tsurumaru
Makai, K., et al., "Planar Multilevel Interconnection Technology," IEEE J. of Solid-State Circuits, vol. SC-13, No. 4, Aug. 1978, pp. 462-467.
IBM Technical Bulletin, Protective Coating for Devices on encapsulated modules, vol. 8 No. 12, May 1966, p. 1705.
Eichelberger Charles W.
Wojnarowski Robert J.
Crane Sara W.
Davis Jr. James C.
General Electric Company
James Andrew J.
Snyder Marvin
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