Soldered component bonding in a printed circuit assembly

Details Soldered component bonding in a printed circuit assembly Soldered component bonding in a printed circuit assembly

1997-02-14

1999-10-26

Sparks, Donald

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

174261, H05K 114, H05K 116, H05K 118

Patent

active

059739320

ABSTRACT:
A printed circuit assembly comprises a module with a component secured to a pad on a dielectric substrate using a tin-free metal composition. A terminal of the module is coupled to a second printed circuit board with a solder composition of at least approximately 40% tin. The tin-free solder composition may comprise approximately 90% lead and 10% antimony.

REFERENCES:
patent: 3439411 (1969-04-01), Lloyd et al.
patent: 4855810 (1989-08-01), Gelb et al.
patent: 4940181 (1990-07-01), Juskey, Jr. et al.
patent: 5684677 (1997-11-01), Uchida et al.
Electri-onics Desk Manual (1985/1986), "Laminated Plastics, Unclad", pp. 101-106.

Affiliated with

Also associated with

Rating

Soldered component bonding in a printed circuit assembly does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldered component bonding in a printed circuit assembly, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldered component bonding in a printed circuit assembly will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-771454