Thick film temperature sensitive device and method and material

Details Thick film temperature sensitive device and method and material Thick film temperature sensitive device and method and material

1982-01-22

1985-05-14

Envall, Jr., Roy N.

Electrical resistors

Resistance value responsive to a condition

Ambient temperature

338308, 252513, 252514, 427101, H01C 704, B44D 120, C23B 562

Patent

active

045175454

ABSTRACT:
A thick film temperature sensitive device and method of making the same, comprising the steps of applying to the surface of a substrate and firing a resistance material comprising a mixture of glass frit and particles containing palladium and iron. The mixture is fired in a non oxidizing, neutral, or reducing atmosphere at a temperature between 700.degree. C. and 1100.degree. C. at which the glass frit softens. When cooled, a device is provided with a glass film strongly bonded to the substrate and having dispersed therein conductive metal particles of an alloy of palladium and iron. The device provides a relatively high positive temperature coefficient of resistance, a relatively high resistivity, and a resistance to temperature characteristic which is highly linear, and can be processed by spiralling and terminated by the use of electroless plating. Further, the palladium and iron are present in the mixture in an amount having a total weight between about 15% and 65%, and the glass frit being present in an amount between 35% and 85% by weight.

REFERENCES:
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patent: 4222025 (1980-09-01), Illes et al.
patent: 4282507 (1981-08-01), Tindell et al.
patent: 4378409 (1983-03-01), Wahlers et al.

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