Semiconductor device enabling temperature control in the chip th

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum

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257774, 257758, H01L 2348

Patent

active

059734019

ABSTRACT:
Disclosed are semiconductor devices employing chips comprising highly integrating semiconductor elements, and having various means for controlling temperature increase of the chips. These means comprise three approaches: means for controlling heat generation by adjusting clock frequencies to be supplied to the chips respectively; means for suppressing heat generation by suitably arranging the wiring construction of the chip substrate; and means for suppressing heat generation of sub-chips by a prarallel process such as optical communication between the sub-chips.

REFERENCES:
patent: 4544941 (1985-10-01), Ariizumi et al.
patent: 5119170 (1992-06-01), Iwamatsu
patent: 5124781 (1992-06-01), Tashiro
patent: 5416355 (1995-05-01), Kudoh

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