Stacked carrier three-dimensional memory module and semiconducto

Details Stacked carrier three-dimensional memory module and semiconducto Stacked carrier three-dimensional memory module and semiconducto

1998-03-03

1999-10-26

Williams, Alexander Oscar

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

257685, 257737, 257738, 257774, 257723, 257730, H01L 2714, H01L 2700, H01L 2334, H05K 720

Patent

active

059733926

ABSTRACT:
A three-dimensional memory module includes a plurality of semiconductor device units, every adjacent two of which are stack-connected via through-holes by a bump connecting method. Each of the plurality of semiconductor device units includes a carrier having a circuit pattern and the through-holes connected to the circuit pattern. The semiconductor device unit also includes at least one semiconductor memory chip mounted on the carrier such that the semiconductor memory chip is connected to the circuit pattern, and at least one chip select semiconductor chip mounted on the carrier to be connected to the circuit pattern such that the chip select semiconductor chip can select the semiconductor memory chip.

REFERENCES:
patent: 4894706 (1990-01-01), Sato et al.
patent: 5016138 (1991-05-01), Woodman
patent: 5222014 (1993-06-01), Lin
patent: 5247423 (1993-09-01), Lin et al.
patent: 5600541 (1997-02-01), Bone et al.
patent: 5633783 (1997-05-01), Yamomoto
patent: 5715144 (1998-02-01), Ameen et al.
patent: 5742477 (1998-04-01), Babe
patent: 5760478 (1998-06-01), Bozse et al.
patent: 5786628 (1998-07-01), Beilstein et al.
patent: 5798562 (1998-08-01), Kelley et al.
patent: 5801438 (1998-09-01), Shirekawa et al.
patent: 5807986 (1998-10-01), Davidson et al.
patent: 5811879 (1998-09-01), Akram
patent: 5838060 (1998-11-01), Comer
patent: 5838551 (1998-11-01), Chon

Affiliated with

Also associated with

Rating

Stacked carrier three-dimensional memory module and semiconducto does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Stacked carrier three-dimensional memory module and semiconducto, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Stacked carrier three-dimensional memory module and semiconducto will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-767928