Perimeter independent precision locating member

Details Perimeter independent precision locating member Perimeter independent precision locating member

1995-12-06

1997-06-10

Crane, Sara W.

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

With contact or lead

257730, 257778, 257797, H01L 2348

Patent

active

056379196

ABSTRACT:
A perimeter independent precision locating member (22) for a semiconductor chip (10) so that contact sites upon the chip will be reliably positioned relative to connection members (18), such as contacts or leads, so that the chip may be electrically engageable. The locating member (22) is disposed upon the surface of the semiconductor chip (10) at a specific position relative the contact sites within the perimeter (24) of the chip and being closely matable with a complementary portion of a housing that contains the connection members (18). The method of making the perimeter independent precision locating member (22) for a semiconductor chip (10) involves coating the chip with a layer of photocurable material, masking the material in relation to the contact sites so that the portion of the material that will become the locating member (22) is exposed, illuminating the exposed portion of the photocurable material, and stripping from the chip the uncured portion to define the locating member (22).

REFERENCES:
patent: 3777221 (1973-12-01), Tatusko et al.
patent: 4565314 (1986-01-01), Scholz
patent: 5182782 (1993-01-01), Tabasky et al.
patent: 5342206 (1994-08-01), Grabbe et al.
patent: 5502631 (1996-03-01), Adachi
patent: 5521427 (1996-05-01), Chia
Patent Abstracts of Japan, vol. 7, No. 236 (E-205) (1381) Oct. 20, 1983.
European Search Report dated Oct. 18, 1994.

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