Encapsulated electronic component and method for encapsulating a

Details Encapsulated electronic component and method for encapsulating a Encapsulated electronic component and method for encapsulating a

1997-08-18

1999-10-26

Sough, Hyung-Sub

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257790, H01L 2328

Patent

active

059732636

ABSTRACT:
An encapsulation body for enclosing an electronic element is disclosed and which includes a first layer of a slow curing two-part epoxy which is in a flowable state; a second layer of material positioned outwardly of the first layer and which substantially retains the first layer of material on the electronic element while the first layer of material is in a flowable state; and a dam surrounding the electronic element, the first and second layers of material received within the dam.

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IBM Technical Disclosures, vol. 11, No. 8, Cameron and Finch, p. 971, Jan. 1969.

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