Method of fabricating flip-chip on leads devices and resulting a

Details Method of fabricating flip-chip on leads devices and resulting a Method of fabricating flip-chip on leads devices and resulting a

1996-09-20

1998-10-06

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Assembly of plural semiconductive substrates each possessing...

438111, 438123, H01L 2144

Patent

active

058175407

ABSTRACT:
A semiconductor die assembly and methods of forming same comprising a lead frame having a plurality of lead fingers and a semiconductor die having a plurality of electric contact points on an active surface of said semiconductor die. The electric contact points are located or rerouted on the semiconductor die active surface so as to maximize the size and spacing of electric contact points relative to the lead fingers, which may be custom-configured to match the "open" array of contact points and widened to enhance surface area for connection thereto. This arrangement results in large and robust flip-chip type interconnections between the electric contact points and the lead frame, eliminating the need for wirebonding and for adhesive connections of the lead frame to the die active surface.

REFERENCES:
patent: 4258382 (1981-03-01), Harris
patent: 4862245 (1989-08-01), Pashby et al.
patent: 4948754 (1990-08-01), Kondo et al.
patent: 5171711 (1992-12-01), Tobimatsu
patent: 5252853 (1993-10-01), Michii
patent: 5331200 (1994-07-01), Teo et al.
patent: 5538920 (1996-07-01), Wakabayashi
patent: 5565379 (1996-10-01), Baba
patent: 5578526 (1996-11-01), Akram et al.
patent: 5587336 (1996-12-01), Wang et al.
Tummala et al, "Microelectronics Packagaing Handbook", Van Nostrand Reinhold, pp. 409-435, 1989.

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