Method of applying layer structure on host surface material

Details Method of applying layer structure on host surface material Method of applying layer structure on host surface material

1998-04-29

1999-09-21

Dixon, Merrick

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156239, 156240, 156277, 4273744, 427375, B44C 1165

Patent

active

059549050

ABSTRACT:
A method of applying a layered structure on a host surface for hot-melt printing is provided. A print pattern layer is placed with a release layer and an upper cellophane sheet on a top surface of the print pattern layer, and a lower cellophane sheet on a bottom surface thereof. The print pattern layer is then seated on top of a host surface material and heat-pressed at a temperature within a temperature range of between 80.degree. to 150.degree. Celsius. Under those conditions, the upper cellophane sheet melts and permeates the print pattern layer to merge with the lower cellophane sheet and is attached onto the host surface material. After regenerative cooling, the release layer is able to be peeled off, forming a protective print pattern layer. The cellophane sheets are formed by applying synthetic resin directly onto the release layer, and by peeling off the release layer to form the upper cellophane sheet and the lower cellophane sheet.

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