Method and arrangement for positioning a second pattern originat

Details Method and arrangement for positioning a second pattern originat Method and arrangement for positioning a second pattern originat

1984-05-18

1985-05-14

Eickholt, E. H.

Printing

Stenciling

Processes

1011271, 101DIG12, 331845, 355 40, B41F 134, B41F 1536, B41L 1302

Patent

active

045164959

ABSTRACT:
Method and arrangement for positioning a second pattern (10a) originating from a first pattern formed on a stencil in relation to a material (8) intended for the pattern. Said second pattern (10a) is formed by causing a coating intended for the material to pass through the first pattern, for example by means of a scraper blade in a silk screen printing machine. The position of the second pattern (10a) relative to a reference point, usually the frame components of the printing machine, is stored in an organ. Once a sheet of material to which the second pattern (10a) is to be transferred has been moved into the printing position, the position of the material or of a pattern which has already been applied to it is evaluated together with any discrepancy which would arise if the second pattern (10a) were to be applied to that material in that position. A frame holding the stencil and/or a printing table and/or the material is displaced or is caused to move in some other way into a position dependent on the size and direction of the discrepancy such that, when the second pattern (10a) is applied to the material, said pattern will adopt a position on the material in which any previously identified discrepancy has been compensated for fully or to a satisfactory extent.

REFERENCES:
patent: 2984910 (1961-05-01), LaCour
patent: 3151400 (1964-10-01), Schmitt
patent: 3566788 (1971-03-01), Haws
patent: 3926112 (1975-12-01), Neman
patent: 3943851 (1976-03-01), Iwada
patent: 4226181 (1980-10-01), Ericsson
patent: 4404903 (1983-09-01), Cronin
patent: 4463673 (1984-08-01), Moore
patent: 4469022 (1984-09-01), Meador

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