System for selective laser assisted plating

Details System for selective laser assisted plating System for selective laser assisted plating

1989-09-22

1990-10-23

Bovernick, Rodney B.

350 37, 350 375, G02B 2700, G03H 128

Patent

active

049646982

ABSTRACT:
A method directed to a system for splitting, imaging and focusing a pulsing laser beam, such as from an excimer laser, onto a workpiece to improve the subsequent metal plating of such workpiece. A preferred technique of laser assisted plating is a system for laser ablating a plurality of contact areas on electrical terminals, where the areas are covered by ablatable resist. The preferred system comprises a carrier strip having a plurality of electrical terminals mounted thereon; a pulsed laser for directing radiation at the carrier strip; a hologram mounted in the radiation path between the laser and the carrier strip for splitting the radiation from the laser into a plurality of radiation beams directed towards the plurality of contact areas; and mechanism for synchronizing the movement of the carrier strip with the pulsing of the laser so that a respective one of the plurality of outgoing beams ablates the resist over a respective one of the contacts as the contact areas move past the hologram.

REFERENCES:
patent: 3990296 (1976-11-01), Erikson
patent: 4170396 (1979-10-01), Kraft
patent: 4348263 (1982-09-01), Draper et al.
patent: 4359259 (1982-11-01), Horner et al.
patent: 4427723 (1984-01-01), Swain
patent: 4473445 (1984-09-01), Smith et al.
patent: 4555321 (1985-11-01), Wicks
patent: 4826290 (1989-05-01), Wreede et al.
patent: 4832798 (1989-05-01), Cvijanovich et al.
patent: 4862008 (1989-08-01), Oshida et al.
Gold Bulletin, 1986, 19, "Laser Surface Alloying of Gold".

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