Process for adhesion using an epoxy resin adhesive composition

Details Process for adhesion using an epoxy resin adhesive composition Process for adhesion using an epoxy resin adhesive composition

1995-09-28

1997-06-10

Sellers, Robert E.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

525 65, C09J16302, C09J16304

Patent

active

056371799

ABSTRACT:
A process for adhesion using an epoxy rein adhesive composition which comprises coating surfaces for adhesion with a two component epoxy resin adhesive composition prepared immediately before the coating by mixing a mixture containing (A) resin powder prepared by ionic crosslinking of resin particles by addition of a metal cation and (B) an epoxy resin with (C) a curing agent of a room temperature curing type for epoxy resins, bringing the coated surfaces for adhesion into contact with each other, and subsequently heating the surfaces for adhesion. The resin particle is constituted with (a) a core formed with a (meth)acrylate polymer and/or a diene polymer which has a glass transition temperature of -30.degree. C. or lower and (b) a shell formed with a copolymer of a (meth)acrylate monomer and a radical polymerizable unsaturated carboxylic acid monomer having carboxyl group and 3 to 8 carbon atoms which has a glass transition temperature of 70.degree. C. or higher. The adhesive composition used in the process can be cured by heating at a moderate temperature of 40.degree. to 100.degree. C., and a high tensile shear strength and T-peeling strength can be achieved.

REFERENCES:
patent: 3833683 (1974-09-01), Dickie
patent: 4657970 (1987-04-01), Shiraki et al.
patent: 4668736 (1987-05-01), Robins et al.
patent: 4778851 (1988-10-01), Henton et al.
patent: 5290857 (1994-03-01), Nakayama et al.
Derwent accession No. 94-347331/43 for Japanese Patent No. 6-271827, Nippon Zeon KK Sep. 27, 1994.
Abstract, No. 87-173887/23 (JP 62-104888), Derwent Publications Ltd.

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