Methods of processing substrates

Details Methods of processing substrates Methods of processing substrates

1983-04-26

1985-05-14

Goldberg, Howard N.

Metal working

Method of mechanical manufacture

Electrical device making

29760, 198345, 269 51, 269903, 408 1R, 409218, 409220, H05K 310

Patent

active

045163189

ABSTRACT:
A pair of spaced holes (32 and 34) are drilled in a substrate blank (10) diametrically along a line (14) defining a future locating edge (22) of a printed circuit board (12). When the substrate blank (10) is then sheared to form the printed circuit board (12), semi-circular recesses (38 and 40) are formed from the spaced holes (32 and 34) in the resultant board locating edge (22). The printed circuit board (12) then is accurately aligned in a processing station in X- and Y-directions by seating board-locating pins (50 and 52) of special configurations in respective ones of the semi-circular recesses (38 and 40).

REFERENCES:
patent: 2959848 (1980-11-01), Savitt
patent: 4255077 (1981-03-01), Smith
patent: 4291867 (1981-09-01), Williams et al.
patent: 4372046 (1983-02-01), Suzuki
patent: 4399988 (1983-08-01), De Shong
Circuit World, vol. 4, No. 1, Oct. 1977, pp. 46-52, The Implications of Automated Assembly by R. B. Smith.

Affiliated with

Also associated with

Rating

Methods of processing substrates does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Methods of processing substrates, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Methods of processing substrates will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-761549