Printed circuit board and method of manufacturing the same

Details Printed circuit board and method of manufacturing the same Printed circuit board and method of manufacturing the same

1996-10-25

1999-10-26

Speer, Timothy

Stock material or miscellaneous articles

Structurally defined web or sheet

Discontinuous or differential coating, impregnation or bond

4283213, 4283044, 428901, B32B 900

Patent

active

059724820

ABSTRACT:
A printed circuit board includes an uncured substrate material with closed voids which are disposed with a through-hole. When the through-hole is formed, voids which exist in the substrate material open from inner wall of the through-hole to form a hollow-shaped part. By filling the through-hole and the hollow-shaped part with conductive paste, the adhesion improves by the increased holding effect between the conductive paste and the wall surface of the through-hole.

REFERENCES:
patent: 4383363 (1983-05-01), Hayakawa et al.
patent: 4967314 (1990-10-01), Higgins, III
patent: 5346750 (1994-09-01), Hatakeyama et al.
patent: 5652042 (1997-07-01), Kawakita et al.
Patent Abstracts of Japan, vol. 15, No. 367 (Sep. 17, 1991).
Patent Abstracts of Japan, vol. 17, No. 640 (Nov. 26, 1993).
Patent Abstract of Japan, vol. 15, No. 506 (Dec. 20, 1991).
Patent Abstract of Japan, vol. 13, No. 413 (Sep. 12, 1989).
Patent Abstract of Japan, vol. 13, No. 230 (May 25, 1989).
Patent Abstract of Japan, vol. 17, No. 583 (Oct. 22, 1993).

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