Electrochemical simulator for chemical-mechanical polishing (CMP

Details Electrochemical simulator for chemical-mechanical polishing (CMP Electrochemical simulator for chemical-mechanical polishing (CMP

1996-06-07

1997-06-10

Smith, James G.

Abrading

Abrading process

Glass or stone abrading

451285, 451 5, B24B 100

Patent

active

056370318

ABSTRACT:
An improved and new apparatus and process for simulating chemical-mechanical polishing (CMP) processes, which allows changes in polish removal rates and removal rate uniformity to be measured online as a function of changes in process parameters without necessity to use monitor wafers and offline thickness measurement tools, has been developed. The result is more efficient and lower cost process development for CMP.

REFERENCES:
patent: 5032203 (1991-07-01), Doy et al.
patent: 5132617 (1992-07-01), Leach et al.
patent: 5320706 (1994-06-01), Blackwell
patent: 5481475 (1996-01-01), Young
patent: 5562529 (1996-10-01), Kishii et al.
patent: 5575706 (1996-11-01), Tsai et al.

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