Wiring forming method, wiring restoring method and wiring patter

Details Wiring forming method, wiring restoring method and wiring patter Wiring forming method, wiring restoring method and wiring patter

1994-07-21

1995-07-04

Hearn, Brian E.

Fishing, trapping, and vermin destroying

437245, 437246, 437923, H01L 2102

Patent

active

054299942

ABSTRACT:
In a method of manufacturing a semiconductor device, a metal film including a metal element is formed on a wiring base layer by ion beam assisted CVD, more specifically, by selectively irradiating a region of the wiring base layer with a focused ion beam while blowing an organic metal gas containing the metal element onto the region irradiated by the ion beam. Thereafter, a low-resistance metal layer is formed on the metal film by electroless plating. Therefore, a metal wiring of low resistivity with a predetermined pattern is formed without a photolithographic process using a resist and also without sputtering or selective etching of the metal film. Consequently, manufacturing costs of a semiconductor device are significantly reduced.

REFERENCES:
patent: 4574095 (1986-03-01), Baum et al.
patent: 4701347 (1987-10-01), Higashi
patent: 5182230 (1993-01-01), Donelon et al.
patent: 5306663 (1994-04-01), Morimoto
patent: 5358907 (1994-10-01), Wong
Harriott et al., "Decomposition of Palladium Acetate Films With A a Microfocused Ion Beam," Applied Physics Letters, vol. 49, No. 24, Dec. 15, 1986, New York, pp. 1661-1662.
Meyer et al., "Metallization of Polytetrafluoroethylene (PTFE)", Extended Abstracts, vol. 90-91, May 6, 1990, Princeton, N.J., U.S., pp. 76-77.
Itoh et al., "MMIC Circuit Optimization Using FIB Techniques", IEEE GaAs IC Symposium, 1991, pp. 323-326.

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