Method of electrically interconnecting conductors

Adhesive bonding and miscellaneous chemical manufacture – Methods – Surface bonding and/or assembly therefor

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1562755, 1562757, B32B 3100

Patent

active

054297010

ABSTRACT:
A method of electrically interconnecting conductors, such as electrical components to a printed circuit board. A plurality of first and second conductors are provided which are discrete and at least one of which is made of soft magnetic material that can be temporarily magnetized. The plurality of first conductors are arranged in a predetermined arrangement on a surface of a substrate. An adhesive layer comprised of a mixture is disposed on the surface of the substrate and over the plurality of first conductors. The mixture is comprised of an adhesive and a predetermined concentration of conductive metal particles made of soft magnetic materials that can be temporarily magnetized. The adhesive has a predetermined viscosity which allows the conductive metal particles to be suspended within the adhesive. The mixture is substantially insulating at the predetermined concentration of conductive metal particles. The plurality of second conductors are arranged above the adhesive layer in vertical alignment with the individual conductors of the plurality of first conductors. The adhesive layer is heated to reduce the viscosity of the mixture. A magnetic field is applied such that the conductive metal particles within the heated adhesive mixture are gathered by the magnetic field to produce a higher concentration of conductive metal particles between the aligned individual conductors of the plurality of first and the second conductors, and provide electrical interconnection therebetween, and to produce a lower concentration of conductive metal particles in adjacent areas of the layer; and hardening the adhesive layer.

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