Gold paste for a ceramic circuit board

Details Gold paste for a ceramic circuit board Gold paste for a ceramic circuit board

1994-02-10

1995-07-04

Bell, Mark L.

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 113, 501 19, 501 20, 501 21, 252514, 252512, 252518, C09D 524, H65K 109

Patent

active

054296706

ABSTRACT:
An improved gold paste for use in the manufacture of ceramic circuit boards is disclosed, which has a composition comprising an inorganic component, an organic binder, a solvent. The inorganic component contains (a) 84-94 wt % powdery gold with a particle size of 0.3-0.7 .mu.m, (b) 0.3-2.0 wt % powdery V.sub.2 O.sub.5 with a particle size of 0.3-2.0 .mu.m, and (c) 0.3-2.0 wt % powdery CuO with a particle size of 0.3-2.0 .mu.m.

REFERENCES:
patent: 3021233 (1962-02-01), Fenity
patent: 3440182 (1969-04-01), Hoffman
patent: 3480566 (1969-11-01), Hoffman
patent: 3516949 (1970-06-01), Hoffman
patent: 3960777 (1976-06-01), Coyle
patent: 3969570 (1976-07-01), Smith

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