1974-09-30
1976-04-13
Miller, Jr., Stanley D.
357 79, 357 81, H01L 2302, H01L 2342
Patent
active
039507785
ABSTRACT:
An improved case member for a power semiconductor device is comprised of compacted powdered iron infiltrated with copper to provide good electrical and thermal contact for the semiconductor element and sufficient mechanical strength for use in a compression bonded encapsulation.
REFERENCES:
patent: 3483439 (1969-12-01), Kosco
Koval Raymond J.
Pomper Edward G.
Menzemer C. L.
Miller, Jr. Stanley D.
Westinghouse Electric Corporation
Wojciechowicz E.
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