Semiconductor device and case member

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Details

357 79, 357 81, H01L 2302, H01L 2342

Patent

active

039507785

ABSTRACT:
An improved case member for a power semiconductor device is comprised of compacted powdered iron infiltrated with copper to provide good electrical and thermal contact for the semiconductor element and sufficient mechanical strength for use in a compression bonded encapsulation.

REFERENCES:
patent: 3483439 (1969-12-01), Kosco

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