Method of depositing a metal on a surface

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

427305, 427306, 96 362, 96 384, 96 48PD, B44D 118, G03C 500

Patent

active

039505707

ABSTRACT:
A method of depositing a metal on a surface of a substrate is disclosed. A surface of the substrate is sensitized with a photosensitive sensitizer comprising a photosensitive species of (1) an element selected from Ni, Mn, U, Mo and W, or (2) a combination of elements comprising Pd and an element selected from In and Ce. The sensitized surface is exposed to a suitable source of radiation, e.g., ultraviolet radiation, to delineate a surface pattern, corresponding to a desired metal pattern, containing a species of at least one selected element which is either (1) capable of reducing an activation metal ion to catalytic activating metal or (2) capable of being reduced to a catalytic activating metal such as catalytic palladium. The ultraviolet radiation-delineated surface pattern is then exposed or treated with a solution comprising an activating metal ion to reduce and deposit thereon an activating metal. The deposited activating metal pattern is then exposed, as by immersion, to a suitable electroless metal deposition solution wherein an electroless metal is catalytically reduced on the activating metal pattern. However, where Pd-In, Pd-Ce sensitizers are employed, exposure to an activating metal ion containing solution is unnecessary and the delineated surface pattern is directly exposed to the electroless metal deposition solution.

REFERENCES:
patent: 2427443 (1947-09-01), Cochran
patent: 3791340 (1974-02-01), Ferrara

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