Method of manufacturing a multiple-layer, non-single-crystalline

Details Method of manufacturing a multiple-layer, non-single-crystalline Method of manufacturing a multiple-layer, non-single-crystalline

1982-09-30

1985-03-19

Newsome, John H.

Coating processes

Electrical product produced

Integrated circuit, printed circuit, or circuit board

118 501, 118719, 118729, 427 86, 427 87, B05D 512

Patent

active

045059500

ABSTRACT:
A process for producing multi-layer semiconductor devices wherein a plurality of Plasma deposition chambers, an entrance and an exit chamber are provided sequentially with shutter means between them. A different layer is laid down in each chamber on a substrate as it passes sequentially through the system of chambers. During deposition, the shutters are closed. After each deposition, the Plasmas are extinguished, the chambers are evacuated or purged, the shutters are opened, the substrates are advanced to the next chamber, the chambers are refilled with the same reactant gases as previously present, the plasmas reignited and another layer deposited.

REFERENCES:
patent: 3472679 (1969-10-01), Ing et al.
patent: 3961103 (1976-06-01), Aisenberg
patent: 4015558 (1977-04-01), Small et al.
patent: 4214926 (1980-07-01), Katsuto et al.
patent: 4223048 (1980-09-01), Engle
patent: 4232057 (1980-11-01), Ray et al.
patent: 4250832 (1981-02-01), Ozaki
patent: 4282268 (1981-08-01), Priestley et al.
patent: 4317844 (1982-03-01), Carlson
patent: 4328258 (1982-05-01), Coleman
Barber "IBM Tech. Disc. Bull." vol. 11, No. 7, 12-1968, pp. 757, 758, 118-729.

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