Optical waveguides – Integrated optical circuit
Patent
1994-08-08
1997-09-09
Ullah, Akm E.
Optical waveguides
Integrated optical circuit
G02B 612
Patent
active
056664460
DESCRIPTION:
BRIEF SUMMARY
STATE OF THE ART
The invention proceeds from a method for the production of a cover for an integrated optical circuit pursuant to the preamble of the main claim.
From patent application DE-P 42 12 208.2, a method for the production of optical polymer components with an integrated fiber chip coupling using casting technology is already known. Here, a polymer substrate is formed by means of a master structure, in order to couple an integrated optical circuit between two glass fibers, in such a way that the glass fibers come to rest in the substrate in a V-shaped groove. In this connection, their longitudinal axis is flush with the longitudinal axis of a lightwave guide channel arranged between the V-shaped grooves. By filling the grooves and the lightwave guide channel with polymer adhesive, when a polymer cover is placed on top, a mechanically strong bond between the substrate and the cover, as well as optical coupling of the glass fibers to the lightwave guide formed of polymer adhesive, is guaranteed.
Furthermore, from the article "Channel glass wave guide detectors with grafted GaAs film in embedded configuration" in Electronic Letters 27 (1991), pages 410 to 412 by Chan, Yi-Yan, et al., it is known to couple a photodetector grafted onto a glass substrate to a lightwave guide located in the substrate, in evanescent manner. This production method requires precise positioning of the wave guide and of the photodetector relative to one another, which must be carried out individually for each component, and comprises a complicated positioning method.
ADVANTAGES OF THE INVENTION
The method according to the invention, with the characterizing features of the main claim, has the advantage, in contrast, that a cover for an integrated optical circuit is produced without positioning effort. Furthermore, there is the advantage that the method according to the invention is particularly suited for mass production, since the location of the optical component with regard to the mold punch is predetermined or results without further intervention. Furthermore, an advantage of the method consists of positioning an optical module with regard to fiber guide grooves for holding lightwave guides, although the optical component is smaller in dimensions than the distance between the guide projections provided for later holding light guides.
With the measures listed in the dependent claims, advantageous further developments and improvements of the method indicated in the main claim are possible.
The accuracy of positioning of the optical component in the mold punch is increased in that at least one positioning device is arranged on the mold punch, which positions the optical component on at least one side.
An advantageous arrangement consists of arranging two positioning devices on the mold punch, which delimit the optical component on opposite sides.
The positioning process when placing the optical component onto the mold punch is simplified in that the sides of the positioning device which face the optical component are beveled and the corresponding side surfaces of the optical component are at least partially beveled. In this way, the tolerance of the component dimensions which are permissible for automatic positioning of the optical component on the mold punch are increased and the positioning process is simplified.
The method is improved by using mold punches which have stress relief projections. The pressure applied to the optical component when the optical component is placed down is uniformly absorbed by the stress relief projections. This achieves the result that optical components made of brittle materials, particularly indium phosphide or gallium arsenide, are not damaged when they are placed on the mold punch. The production method is particularly suitable for bonding photodetectors to integrated optical lightwave guides, since here, particularly precise positioning is necessary, which be achieved in simple manner with the method according to the invention.
The cover according to the invention can be produced parti
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Robert & Bosch GmbH
Ullah Akm E.
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