Low pressure, thin film bonding

Details Low pressure, thin film bonding Low pressure, thin film bonding

1974-07-29

1976-04-13

Weston, Caleb

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156285, 156325, 156330, B29C 2712

Patent

active

039502040

ABSTRACT:
Disclosed is a method particularly useful in fabricating microwave components for joining two metallic surfaces together to form an extremely strong bond, having good electrical and mechanical characteristics. One surface is primed or prepared with a suitable primer. An alloy adhesive, such as a polyamide-epoxy, is either deposited on the prepared surface or, if the adhesive is in film form on a release paper, then the film and release paper are heat tacked or ironed onto the prepared metallic surface. The paper release backing is then removed and the two metallic surfaces are mechanically assembled and positioned within a vacuum bag. The bag is evacuated and subjected to normal atmospheric pressure (14 psi) and heated to approximately 350.degree. for 1 hour whereupon the component is allowed to cool to 100.degree.F at which time the vacuum may be released and the component removed from the bag.

REFERENCES:
patent: 3481814 (1969-12-01), Salyer et al.
patent: 3706621 (1972-12-01), Lichtman
patent: 3723223 (1973-03-01), Compte

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