Method of making low thermal expansivity and high thermal conduc

Details Method of making low thermal expansivity and high thermal conduc Method of making low thermal expansivity and high thermal conduc

1985-06-24

1987-04-21

Ball, Michael

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

29DIG31, 264122, 419 65, C22C 2912

Patent

active

046594043

ABSTRACT:
A composite is provided which is adaptable to be a substrate for an electronic application. The composite comprises first material particles having a coefficient of thermal expansion in the range of about -20.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree. C. Second material particles having a coefficient of thermal expansion in the range of about 100.times.10.sup.-7 to about 200.times.10.sup.-7 in/in/.degree. C. are mixed with the first material particles. A bonding agent adheres the first and second material particles into a coherent composite having a coefficient of thermal expansion in the range of about 1.times.10.sup.-7 to about 50.times.10.sup.-7 in/in/.degree. C.

REFERENCES:
patent: 3305923 (1967-02-01), Zimmer
patent: 4400643 (1983-08-01), Nishio et al.
patent: 4569692 (1986-02-01), Butt

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