Compression type semiconductor device

Details Compression type semiconductor device Compression type semiconductor device

1980-03-04

1982-11-09

Edlow, Martin H.

357 68, H01L 2342

Patent

active

043587852

ABSTRACT:
A compression type semiconductor device includes a semiconductor element; at least one metal plate having substantially upright edge surfaces, a planar contacting surface engaging a first surface of the semiconductor element and a continuous curved surface interconnecting the edge surfaces and the contacting surface; and a means for pressing the contacting surface of the metal plate against the first surface of the semiconductor element. The continuous curved surface of the metal plate is so formed that at each point on the periphery of the contacting surface at least one plane normal to the contacting surface intersects the curved surface in an arcuate curve which tangentially joins the contacting surface.

REFERENCES:
patent: 3772764 (1973-11-01), Furnwal
patent: 3991461 (1976-11-01), Anderson
patent: 4100566 (1978-07-01), Okikawa

Affiliated with

Also associated with

Rating

Compression type semiconductor device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Compression type semiconductor device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Compression type semiconductor device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-748316