Apparatus for replacement of through-hole mounted PCB components

Details Apparatus for replacement of through-hole mounted PCB components Apparatus for replacement of through-hole mounted PCB components

1985-08-08

1987-04-21

Godici, Nicholas P.

Metal fusion bonding

With control means responsive to sensed condition

228 36, 228 39, 228 561, 228 565, 228264, 118429, 164312, 222594, B23K 108, B23K 3706

Patent

active

046590021

ABSTRACT:
An apparatus is disclosed for removing or installing at least one through-hole mounted component from a printed circuit board or the like, the apparatus including a compliant mask for contacting and supporting the printed circuit board with the mask having at least one hole extending therethrough and the hole being aligned with the component. A conduit is provided for directing liquid solder into the hole in the mask to contact leads of the component and thus facilitate installation or removal thereof from the board.

REFERENCES:
patent: 2964007 (1960-12-01), Buffington
patent: 3361869 (1968-01-01), Gutbier et al.
patent: 3511304 (1970-05-01), Baier et al.
patent: 3613768 (1971-10-01), Awano et al.
patent: 3684151 (1972-08-01), Burman et al.
patent: 3901306 (1975-08-01), Miki et al.
patent: 4412641 (1983-11-01), Fuchs et al.
patent: 4426571 (1984-01-01), Beck
patent: 4506820 (1985-03-01), Brucker
patent: 4527731 (1985-07-01), Kent et al.

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