High temperature molds and composition for same

Metal founding – Process – Shaping a forming surface

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Details

164529, 164364, 523144, B22C 122, B22C 900

Patent

active

046588868

ABSTRACT:
A high temperature mold assembly particularly adapted for thermit reaction welding, and mold components and mold compositions therefor, based on a mined aggregate containing carbon and silica and thermosetting, non-hygroscopic resinous binder.

REFERENCES:
patent: 3103719 (1963-09-01), Bishop et al.
patent: 4134442 (1979-01-01), Laitar
patent: 4430459 (1984-02-01), Akerburg et al.
patent: 4478269 (1984-10-01), Akerburg
ERICO.RTM. Products, Inc., brochure No. A-1A-01 entitled Cadweld.RTM. Grounding Connections, dated 1978 (cover page and last two pages thereof).

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