Method of electrically interconnecting semiconductor elements

Details Method of electrically interconnecting semiconductor elements Method of electrically interconnecting semiconductor elements

1974-12-06

1976-01-13

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

29589, 204 15, C25D 502

Patent

active

039322262

ABSTRACT:
An improved method of electrically interconnecting a plurality of spaced semiconductor elements adjacent to a substrate, each element having a mesa shape with a top surface spaced apart from the substrate and a side surface, includes coating the side surfaces of the elements with a protective material, filling in the space above the substrate and in between the elements with a temporary support material, depositing a continuous electrically-conductive layer on the support material and in electrical contact with the top surfaces of a plurality of the elements, and then removing the temporary support material to form an electrically-conductive homogeneous air-bridge. The protective material protects the elements from being exposed to the temporary support material. By this method, a plurality of metallized air-bridges can be formed simultaneously.

REFERENCES:
patent: 3514378 (1970-05-01), MacDougall
patent: 3859180 (1975-01-01), Hasty

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