Method of forming leads on a lead frame

Details Method of forming leads on a lead frame Method of forming leads on a lead frame

1981-10-05

1983-07-19

Hall, Carl E.

Metal working

Method of mechanical manufacture

Electrical device making

339 17CF, 29874, H01R 4300

Patent

active

043935818

ABSTRACT:
The present invention relates to a chip carrier wherein the leads therefrom are formed into a closely spaced pattern. More particularly, the invention discloses the method of stamping and forming the leads to achieve a high density arrangement.

REFERENCES:
patent: 3416348 (1968-12-01), Carter, Jr. et al.
patent: 3614546 (1971-10-01), Avins
patent: 4217020 (1980-08-01), Holland

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