Plural semiconductor devices mounted between plural heat sinks

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357 15, 357 56, 357 75, H01L 2302, H01L 2948, H01L 2956

Patent

active

041609921

ABSTRACT:
A microwave semiconductor device with improved thermal properties is disclosed wherein multiple active semiconductor bodies are disposed between two electrically and thermally isolated heat sinks. Two separate thermal paths are provided for heat produced within the semiconductor material. The maximum operating power of devices such as double-drift IMPATT diodes is greatly extended.

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