Patent
1977-09-14
1979-07-10
James, Andrew J.
357 15, 357 56, 357 75, H01L 2302, H01L 2948, H01L 2956
Patent
active
041609921
ABSTRACT:
A microwave semiconductor device with improved thermal properties is disclosed wherein multiple active semiconductor bodies are disposed between two electrically and thermally isolated heat sinks. Two separate thermal paths are provided for heat produced within the semiconductor material. The maximum operating power of devices such as double-drift IMPATT diodes is greatly extended.
REFERENCES:
patent: 3176202 (1965-03-01), Uhlir
patent: 3231794 (1966-01-01), Diebold
patent: 3249891 (1966-05-01), Rutz
patent: 3320497 (1967-05-01), Neuf
patent: 3469171 (1969-09-01), Toulemonde
patent: 3551842 (1970-12-01), Nelson
patent: 3649881 (1972-03-01), Chang et al.
patent: 3686541 (1972-08-01), Livezey et al.
patent: 3728236 (1973-04-01), Weller et al.
patent: 3740617 (1973-06-01), Teramoto et al.
patent: 3903592 (1975-09-01), Hecki
patent: 3932226 (1976-01-01), Kiatskin et al.
patent: 3956820 (1976-05-01), Swartz et al.
patent: 4030943 (1977-06-01), Lee et al.
patent: 4034394 (1977-07-01), Kamo et al.
Bartlett Milton D.
James Andrew J.
Pannone Joseph D.
Raytheon Company
Sharkansky Richard M.
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